Low cycle fatigue behavior of a eutectic 80Au/20Sn solder alloy

The eutectic 80Au/20Sn solder alloy is widely used in high power electronics and optoelectronics packaging. In this study, low cycle fatigue behavior of a eutectic 80Au/20Sn solder alloy is reported. The 80Au/20Sn solder shows a quasi-static fracture characteristic at high strain rates, and then gradually transforms from a transgranular fracture (dominated by fatigue damage) to intergranular fracture (dominated by creep damage) at low strain rates with increasing temperature. Coffin-Manson and Morrow models are proposed to evaluate the low cycle fatigue behavior of the 80Au/20Sn solder. Besides, the 80Au/20Sn solder has enhanced fatigue resistance compared to the 63Sn/37Pb solder.     

高强WSTi544221合金组织与性能研究

研究了轧制变形量对WSTi544221合金棒材显微组织和力学性能的影响,并对Φ10 mm规格的棒材进行不同制度的固溶+时效处理,对比了不同热处理状态下棒材的组织和力学性能。结果表明,随着轧制变形量的增大,WSTi544221合金棒材的晶粒细化程度增大,强度逐渐提高,但塑性变化不大。经870℃×1 h/WC+520℃×6 h/AC固溶+时效处理后,强度与塑性可以获得良好匹配,当抗拉强度达到1 610 MPa、屈服强度达到1 531 MPa时,延伸率和断面收缩率可分别保持在12%和43%。     

基于密闭爆发器试验的发射装药内弹道性能预估

为了预估发射装药的内弹道性能,建立了一种基于密闭爆发器试验检测发射药的静态燃烧性能参数进而预测其装药内弹道性能的方法,采用不同批次的单樟-5/7发射药进行了装药性能预估计算,并基于30 mm火炮对内弹道性能预估精度进行了试验验证。结果表明,采用所建立的基于密闭爆发器试验的发射装药内弹道性能预估方法计算获得的最大膛压为376.0 MPa,与试验测试的膛压平均值388.7 MPa的计算误差为3.27%;计算的炮口初速为1143.5 m/s,与试验测试的炮口初速平均值1156.3 m/s的计算误差为1.11%。所建立的基于密闭爆发器试验的发射装药内弹道性能预估方法具有较高的精度,可对发射药样品不同批次间的内弹道性能进行高效精确的预估,为长期贮存发射药使用寿命的判定及发射药产品的出厂校验提供了一种高效低成本的弹道性能评价方法。     

钛合金表面多磁极耦合旋转磁场光整加工特性

面向激光增材制造钛合金表面的光整加工需求，设计出一种多磁极耦合旋转磁场光整加工装置来研究光整加工特性。基于ANSYS Maxwell仿真软件分析了光整加工装置的磁场强度分布。搭建了实验光整平台，分析了主轴转速、C轴转速和加工间隙对表面质量的影响。结果表明，在主轴转速500 r/min、C轴转速160 r/min和加工间隙0.7 mm的加工条件下，表面粗糙度Ra由5.991 μm下降至0793 μm。扫描电子显微镜(SEM)观测表明，光整后的钛合金表面沉积层消失，表面质量得到显著改善。     

轧制速度对AZ31镁合金管材冷轧成形的影响

轧制速度是三辊式冷轧成形过程中关键的工艺参数，决定其力学特征及温升情况。基于此，本文以冷轧AZ31镁合金管材为研究对象，通过全流程数值仿真计算，对比分析不同轧制速度在各特征变形段对等效应力、等效塑性应变及节点温度的影响规律。结果表明，等效应力、等效塑性应变及节点温度均随轧制速度的增大而增大。通过元胞自动机模型及实验等手段，探明了晶粒在轧制过程中产生连续再结晶并细化的初步组织演变规律；对比分析实验与模拟结果并结合多方面因素，得到800mm/s的轧制速度可以更好的满足工艺要求的结果，为冷轧镁合金管材轧制速度的选择提供依据。     

转速对2524铝合金搅拌摩擦点焊组织与性能的影响

对2524铝合金薄板进行搭接搅拌摩擦点焊试验, 研究了搅拌头转速对其组织与性能的影响。结果表明, 随转速增加, 焊点外侧飞边越加严重, 组织畸变程度增加, 焊核区宽度增大, 有效连接宽度先增大后减小。母材区硬度最大, 热影响区硬度最低;在焊核区内, 显微硬度随转速增加而增大, 当转速为1 100 r/min时达到最大133.9HV, 而热影响区在300 r/min时硬度最大。在单向拉伸试验中, 接头剪切强度随转速增加先增大后减小, 在700 r/min时达到最大值3 510 N;接头呈现出两种断裂模式: 即低转速下平行于两板面断裂和高转速下沿倾斜方向断裂;断口呈现明显的剪切韧窝形态, 韧窝小而浅, 焊接接头为韧性断裂。     

强变形工艺对2519A铝合金组织与性能的影响

通过硬度测试、拉伸性能测试、透射电镜观察等分析手段研究了不同强变形工艺下2519A铝合金的力学性能与微观组织。结果表明,经50%的冷轧变形和165 ℃人工时效后,2519A合金的力学性能明显提高,其抗拉强度、屈服强度和伸长率分别为522 MPa、468 MPa和8.5%。而在冷变形前添加165 ℃×2 h预时效处理,合金的力学性能进一步提高,其抗拉强度、屈服强度和伸长率分别达到535 MPa、497 MPa和8%。预时效处理可以提高合金中θ′相的密度,使析出相分布更加均匀,有助于提高合金的力学性能。     

铸态Mg-xSn-1Mn合金的显微组织和阻尼性能

采用光学显微镜(OM)、维氏硬度计、热动态分析仪、X射线衍射(XRD)、多功能内耗仪等,研究了Sn含量对Mg-xSn-1Mn合金显微组织、阻尼性能和力学性能的影响。结果表明:当Sn含量从2%增加到8%时,Mg-xSn-1Mn合金的枝晶间隙呈现细化的趋势,硬度从43.84 HV0.1增加至54.00 HV0.1,呈单调增加的趋势。应变无关阻尼随着Sn含量的增加呈现先增后减的趋势,在Sn含量为4%时达到最大,应变相关阻尼则随着Sn含量的增加呈现逐渐减小的趋势。在低温阶段,相同Sn含量的合金的阻尼随着频率的增大呈现增加的趋势;但在高温下,阻尼值在低频时的上升速率比高频时快,并随着温度的升高,低频阻尼和高频阻尼趋向于相等。当Sn含量不同时,随着温度的升高,Sn含量较高的合金的阻尼值上升速率变快。     

Study on the hydrogen storage properties of a TiZrNbTa high entropy alloy

High-entropy alloys (HEAs), as a new class of metallic materials, have received more and more attention due to its excellent mechanical properties. In this study, the hydrogen absorption properties, such as hydrogen absorption capacity, thermodynamics, kinetics and cyclic properties, as well as the hydride structure of a newly designed TiZrNbTa HEA were investigated. The results showed that multiple hydrides including ε-ZrH₂, ε-TiH₂ and β-(Nb,Ta)H were found in the TiZrNbTa HEA after hydrogenation. With the increase of temperature from 293 K to 493 K, the maximum hydrogen absorption capacity decreased from 1.67 wt% to 1.25 wt% and the plateau pressure related with β-(Nb,Ta)H hydrides increased from 1.6 kPa to 14.8 kPa. The formation enthalpy of β-(Nb,Ta)H hydride was determined to be −6.4 kJ/mol, which was less stable than that of NbH and TaH hydrides. The results also showed that the TiZrNbTa HEA exhibited a rapid hydrogen absorption kinetic even at the room temperature with a short incubation time, and the hydrogen absorption mechanism was determined to be the nucleation and growth mechanism. Moreover, the hydrogen absorption capacity at 293 K decreased slowly with the cycle numbers, and remained 86% capacity after 10 cycles. Cracking occurred after hydrogen absorption and became worse with cycles.     

Evaluation of expanded gamut software solutions for spot color reproduction

Expanded gamut printing is an approach in color reproduction that expands the color gamut of conventional CMYK printing processes via the use of additional colorants, such as Orange, Green, and Violet inks. This study evaluates the ability of commercial color management software to create an accurate solution for an expanded gamut printing system. In this study, two printing processes were used, an Epson SureColor P9000 inkjet printer/proofer and an HP Indigo 7900 digital production press, both with 7-color expanded gamut ink sets. Software solutions from Alwan, CGS ORIS, ColorLogic, GMG Color, Heidelberg, and Kodak were evaluated. The systems were tested to see how well they could reproduce the colors in the entire PANTONE+ Solid Coated spot color library. It is shown that the solutions are able to reproduce 89% to 94% of the spot colors on the Epson P9000 inkjet printer and 77% to 87% of the library on the Indigo 7900, both to less than two CIEDE2000 (a typical tolerance in label and packaging work). The number of color patches in expanded gamut characterization test charts was noted, as this is still an area of proprietary, nonstandardized working practice. There are many different colorant combinations that can make the same color in expanded gamut printing. The ink build created by the different software solutions was studied, as it relates to press stability through appropriate choice of colorants. Pantone and Adobe provide everyday commercial tools for expanded color workflows. The study identified some issues with products from these companies that could confuse a less-skilled user in a busy production environment. The conclusion of the study is that expanded gamut solutions for spot color printing produce totally acceptable results for digital printing processes; expanded gamut printing is ready, here and now. The findings show that expanded gamut printing can replace cumbersome conventional spot color workflows creating considerable savings and advantages, especially for label and packaging printers.